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- ラスベガス バカラrcent of solder footprint (i.e., ratio of the soldered area between the land and the pad) is needed between the Exposed PAD (GND) and the pad on the board?
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SupportProducts FAQラスベガス バカラrcent of solder footprint (i.e., ratio of the soldered area between the land and the pad) is needed between the Exposed PAD (GND) and the pad on the board?
UsageV-by-One HS・LVDS
Make sure that 50% or more of the Exposed PAD’s surface is soldered to the land on the board.
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